Welcome to Xiaoji Yang

110 Forsyth Street, 325 Dana Hall
Electrical and Computer Engineering Department
Northeastern University, Boston, MA 0211
Home Ph: (617) 306-6797
Office Ph: (617) 373-3059
Fax: (617) 373-7878
Email: xyang@ece.neu.edu

Research Education Experiences Projects Courses

Research Interests

Research in Plasma Engineering/Applications
Interest in designing, developing and manufacturing on MEMS/Microelectronics/Microfabrication areas

Education Background

Ph.D

Major in Electrical and Computer Engineering, Northeastern University, Boston, MA
Speciality in Electronic Circuits, Solid State Devices and Microfabricatoin, Plasma Engineering
Advisor: Professor Jeffrey A. Hopwood

M.S

Major in Electronic Engineering , Tsinghua University, Beijing, P. R. China, (January 1996)
Speciality in Physical Electronics and Optoelectronics
Advisor: Professor Zhiqiang Yin

B.S

Major in Electronic Engineering , Tsinghua University, Beijing, P. R. China, (July 1993)
Speciality in Physical Electronics and Optoelectronics

Experiences

Research
Assistant

(1999 to present)

Electrical and Computer Engineering, Northeastern University, Boston, MA

Conducted research work on Plasma Etching of Cesium iodide (CsI)
Troubleshot and optimized the film deposition and etching process
Measuring wafer temperature in plasma with interferometroy
Construct a model to explain the mechanism of ICP etching CsI

Lecturer

(1996 to 1999)

Electronic Engineering Department, Tsinghua University, Beijing, P.R.China

Research
Assistant

(1993 to 1996)

Conduct research on optical composite thin film models and depostion for energy saving (The program is sponsored by the national "9·5" plan)
Conduct research on the spectral selective film for solor energy conversion (The program is sponsored by the National "8·5" plan)
Designed a circuit for capacitance manometer for measuring vacuum
Taught undergraduate students "Thin Film Physics and Technology".

Projects

(1999-present)

Plasma Etching of Cesium Iodide (CsI)

Descriptions:

To improve the spatial resolution of digital X-ray imaging sensor, a continuous CsI film is etched into pixeles to decrease the scattering of photons stimulated inside the CsI. An ICP plasma is used to implement the etch. The anisotropic etch as deep as 50um has been reached. The study of mechanisms of ethcing CsI in Ar and CF4 is under way. (Understand the project)

(1996-1999)

Study of Low-e coatings on galss substrate

Descriptions:

This project is to develop a coating on glass window in large area, which has high transmittance in the visible region and high reflectance in infrared region (Low-e). The average transmittacne in visible region is greater than 60% (AM2), and the average transmittance at 80ºC is less than 0.1. Several material stack have been implemented with magnetron sputtering process, such as ITO (indium - tin - oxide), dielectric / metal / dielectric film stack and TiN. The resistance of the film stack in acid and alkali has also been implemented.
( This project is sponsored by the National "9 5" Plan in China)

(1993-1998)

Spectral selective films for solar energy conversion

Descriptions:

This project is to improve the performance of the spectral selective film stack for higher solar energy absorptance and lower infrared emittance. Such kind of films can be used in solar energy generator and routine used hot water applications. The absorptance in solar energy is about 97% (AM2), and the emittance in 80ºC is less than 0.04. Aluminum-based composite films have been implemented with magnetron sputtering system.
( This project is sponsored by the National "8 5" Plan in China)

ECE 3395

VLSI Design

Low Power 4bit X 4bit Multiplier Research

Descriptions:

Implement serial and parallel multipliers with static CMOS, dynamic CMOS and pseudo-NOMS techniques. Explore the area, propagation delay and power for the different implementations.

CAD Tools:

Hspice

ECE 3485

Digital Hardware Synthesis

Implement a design using the Synopsys high level synthesis tools

Descriptions:

Synopsys Behavioral Complier design tools and VHDL language to design a 21-tap low-pass Finite Impulse Response (FIR) filter with a cutoff frequency of 2K Hz..

CAD Tools:

C Language, VHDL, Synopsys Compiler

ECE 3610

Electronic Circuits for
Analog Signal Processing

Design an rail-to-rail op-amp to be operated from +1.5V

Descriptions:

Open-loop gain > 70dB
Unity gain bandwidth > 10MHz
phase margin for unity gain of 60°
common-mode input range of +1.5V
common-mode rejection ratio > 80dB
power dissipation should be less than 5mW

CAD Tools:

PSPice

Courses

Semiconductor Microfabrication, Design and MEMS

Microfabrication

ECE 3626

Integrated Circuits Fabrication Processes 1

ECE3629

Integrated Circuit Fabrication Processes: Plasma Processing

ECE 3641

High Speed/High Frequency Solid State Devices

ECE 3384