Objective Engineering position in semiconductor devices and circuits or MEMS design and development.
Master of Electrical Engineering, Northeastern University, Boston
GPA: 3.88/4.0, Graduation date: May, 2001
Master of Electrical Engineering, Huazhong University of Science and Technology, China
GPA: 3.50/4.0, Graduation date: July, 1998
Research Assistant, Northeastern University, Boston, MA [September 1998 - present]
Thermal Characterization of MEMS Microswitch Contacts: Established FEA models in ANSYS to analyze electrical and thermal characteristics of MEMS microswitch contacts. Developed programs in Labview to test microswitches. Performed SEM analysis of contacts subjected to high-current testing.
Research Assistant, Huazhong University of Science and Technology [September 1995 - July 1998]
Design and Fabrication of Optical Thin Films.
Finite Element Analysis using ANSYS
Performed finite element analysis of microswitch thermal-electrical characteristics. Simulate and analyze different geometry of our microswitches. The results will be used to build microswitches with better current handling capability.
Ran thermal evaporation and sputtering processes for optical thin films. Ran a wet etch release process for microswitches. Performed microswitch failure analysis using SEM.
Developed LABVIEW programs to characterize microswitches built at Northeastern. LABVIEW programs interfaced with National Instruments DAQ boards and with Keithley source measure units through GPIB.
Designed filters for Digital Signal Processing. Wrote routines to analyse and graph microswitch measurement data.
Software packages and languages SPICE, TSUPREM, MEDICI, C, Fortran.
NMOS Design and Modeling (for Physics of Semiconductors II)
The NMOS half of a CMOS transistor was designed using 0.18m m technology using TSUPREM and MEDICI.
Photodiode Design (for Physics of Semiconductors I)
Designed a photodiode to operate at 1.3m m wavelength with a signal/noise ratio of 5.
Analog Integrated Circuits Physics of Semiconductors IC Fabrication
Optoelectronics Applied Optics Physical Optics
Heat Conduction Advanced Mechanics of Materials Theory of Elasticity
Digital Signal Analysis Linear System Analysis
VLSI Design Computer Architecture Computer Hardware Synthesis