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This paper presents heterogeneous integration of
Single-Walled Carbon Nanotubes (SWNTs) with CMOS
integrated circuits using die-level post processing. Low temperature
dielectrophoretic assembly was utilized for the placement of the
SWNTs on to these electrodes.
Electrical measurements from the assembled SWNTs yield ohmic
behavior with a two-terminal resistance of ~44K£[. The SWNTs
were incorporated on to the CMOS chip as a feedback element of
a two-stage Miller compensated high gain operational amplifier. This paper lays the
foundation for the realization of next generation integrated nanosystems with active nanostructures on CMOS integrated
circuits. |
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