Three Dimensional Vertical Interconnects using Single-Walled Carbon Nanotubes
 
We have assembled three dimensional (3D) single-walled carbon nanotubes (SWNTs) using dielectrophoresis (DEP). Encapsulation of the structure with a thin parylene layer both protects it form the environment as well as lowers the contact resistance. This assembly procedure is versatile, inexpensive, is achieved at room temperature . The three dimensional nanoassembly has potential applications in building three dimensional nanosensors, nanoactuators, and for high density vertical integration of microelectronics.