Three Dimensional (3D) Au Nanoparticle Assembly

A novel technological approach for three-dimensional (3D) assembly of gold nanoparticles using dielectrophoresis (DEP). To realize this 3D assembly, a micromachined platform is fabricated which is applicable for assembling conductive nanostructures. The assembly process is achieved at room temperature and is compatible with conventional semiconductor manufacturing and batch fabrication. This method has potential applications in making high density nanobiosensors.