ECE G244, MTM G260 Microelectromechanical Systems
Fall 2006, Tuesday and Friday, 9:50-11:30 AM, 208 Kariotis

Professor George Adams
Office: 203 Snell Engineering
E-mail: adams@coe.neu.edu
Phone: (617) 373-3826
FAX: (617) 373-2921
http://www1.coe.neu.edu/~adams_g
Hours: Tues. 3:30-5:00 and 5:30-5:50, Wed. 2:50-4:30, Thurs. 5:30-5:50, or by appointment, e-mail or phone.

Professor Nick McGruer
Office: 326 Dana
E-mail: mcgruer@ece.neu.edu
Phone: (617) 373-2066
FAX: (617) 373-8970
http://www.ece.neu.edu/edsnu/mcgruer/mcgruer.html/
Hours: Monday, 9:30-10:30, Thursday, 10-11, or by appointment, e-mail or phone.

Text: Microsystem Design, Stephen D. Senturia, Kluwer Academic Publishers, 2001, ISBN 0-7923-7246-8.

Prerequisites: Graduate Standing in Engineering.

Grading: Homework 34%, Exams 33% total, Projects 33%

OVERVIEW: This course will give a broad introduction to MEMS technology, and will give students an opportunity to study the current literature and to design MEMS. The course will cover a sufficient selection of the huge number of technologies used in MEMS such that the fabrication and operation of most MEMS devices will be understandable. This will also provide background for student design projects in the second half of the course. Design projects will run concurrently with discussion of MEMS physical principles and MEMS case studies in class. Topics include microfabrication and process integration; modeling of electromechanical components; transduction technologies; selected coverage of elasticity, structures, dissipation, contact mechanics, friction, and fluids, noise; and case studies of microsystems.

Note: Microfabrication of MEMS devices will be covered in order to understand the major MEMS fabrication technologies and how they interact with system design strategies. Some aspects of process integration will be discussed. For more complete coverage of microfabrication see ECE 3626, IC Fabrication.

References on reserve in the library:

1. Analysis and Design of Analog Integrated Circuits, Third Edition, Gray and Meyer, Wiley, 1993, ISBN 0-471-57495-3. (This is a graduate-level electronics textbook.)

2. The Science and Engineering of Microelectronic Fabrication, Second Edition, Campbell, Oxford, 2001, ISBN 0-19-513605-5. (General Microfabrication Reference.)

3. Fundamentals of Microfabrication, Madou, CRC Press, 1997, ISBN 0-8493-9451-1. (Microfabrication for MEMS + some information on materials and devices.)

4. Micromachined Transducers Sourcebook, Kovacs, McGraw-Hill, 1998, ISBN 0-07-290722-3. (General MEMS reference with an emphasis on a very large number of transduction methods.)

5. Microelectronic Circuits, Fourth Edition, Sedra and Smith, Oxford, 1998, ISBN 0-19-511663-1. (Undergraduate electronics text.)

6. Arthur P. Boresi, Richard J. Schmidt, Omar M. Sidebottom, Advanced Mechanics of Materials, 5th Edition John Wiley, 1993. (Introduction to elasticity and graduate level structural mechanics.)

7. Singiresu S. Rao, Mechanical Vibrations, 4th Edition, Pearson Prentice Hall, 2004. (Introduction to vibrations of mechanical systems.)

8. Dudley D. Fuller, Theory and Practice of Lubrication for Engineers, 2nd Edition, Wiley-Interscience, 1984. (Fundamentals of lubrication theory.)

Books:

• Gabriel M. Rebeiz, RF MEMS, Theory, Design, and Technology, Wiley Interscience, 2003.
• Nadim Maluf, An Introduction to Microelectromechanical Systems Engineering, Artech House, 2000.
• M.H. Bao, Micro Mechanical Transducers, Volume 8, Handbook of Sensors and Actuators, Elsevier, 2000.
• Masood Tabib-Azar, Microactuators, Kluwer, 1998.
• Ljubisa Ristic, Editor, Sensor Technology and Devices, Artech House, 1994
• D. S. Ballantine, et. al., Acoustic Wave Sensors, Academic Press, 1997
• H. J. De Los Santos, Introduction to Microelectromechanical (MEM) Microwave Systems, Artech, 1999.
• James M. Gere, Mechanics of Materials, 6th Edition, Thomson Brooks/Cole, 2004. (Undergraduate structural mechanics.)
• Arthur P. Boresi and Ken P. Chong, Elasticity in Engineering Mechanics, 2nd Edition, Wiley-Interscience, 2000. (Graduate level elasticity).
• Bruce R. Munson, Donald F. Young, and Theodore H. Okiishi, Fundamentals of Fluid Mechanics, 3rd Edition, John Wiley & Sons, 1998. (Undergraduate fluid mechanics.)

Reprint collections:

• R. S. Muller, et. al., Editors, Microsensors, IEEE Press, 1991
• W. Trimmer, Editor, Micromechanics and MEMS, IEEE Press, 1997

Journals:

• J. Microelectromechanical Systems (IEEE/ASME)
• Sensors and Actuators (Elsevier)
• Sensors and Materials (MYU, Japan -- in English)
• J. Micromechanics and Microengineering (IOP)

Major conference proceedings:

• Transducers 'XX (International Conference on Solid-State Sensors and Actuators), odd-numbered years since 1983, proceedings available from IEEE (US Meetings), Elsevier (European Meetings), IEE Japan (Japanese Meetings).
• MEMS 'XX (IEEE Workshop on Micro Electro Mechanical Systems), annual since 1989.
• Eurosensors 'XX, annual since 1987, proceedings published in special issues of Sensors and Actuators.
• Solid-State Sensors and Actuators Workshop, Hilton Head, SC, even-numbered years since 1984, proceedings available from Transducer Research Foundation.
• Japanese Sensor Symposium, annual since 1982; technical digest published in English by the Institute of Electrical Engineers of Japan (IEE)

Web sites:

• ISI MEMS Archive: http://mems.isi.edu/mems (wide range of mems information including information on materials)
• Links to University and other MEMS Web Sites: http://microsystems.stanford.edu/MEMS_ED05/courses_byschool.htm
• Microfabrication Laboratory at Northeastern University: http://www.ece.neu.edu/groups/mfl/
• Berkeley Sensors and Actuators Center: http://www-bsac.eecs.berkeley.edu/
• DARPA/MTO: http://www.darpa.mil/MTO/ -- The Microsystems Technology Office at DARPA.
• Dave Banks' Introduction to MEMS: http://www.dbanks.demon.co.uk/ueng/
• ADI Microrelay/Isolator: http://www.analog.com/umic/
• TI Micromirror Device: http://www.dlp.com/dlp/default.asp
• Web Elements: http://www.webelements.com/ (Properties of elements.)
• Web Site for Text (Senturia): http://web.mit.edu/microsystem-design/www/

Course Outline (This may change somewhat!)

Co-operation on coursework:

There is no restriction on cooperation, discussions, use of texts, library materials, or other sources while learning how to do any assignment. If a solution to a problem is found in the literature, students are expected to provide correct citations to that literature. For the individual homework assignments, every student is expected, at the end, to have worked through their own analysis or modeling work and to have written up their own work for submission. Under no circumstances is it permitted to present another student's work as one’s own. For term projects, a single report from each team is to be prepared. Cooperation in this case is an essential part of the assignment.

Credits: This course draws on ideas from similar MEMS courses offered by S. Senturia, K. Pister, and R. Ghodssi.