Term Projects

Some preliminary ideas for projects are listed below. These are just some ideas of the sorts of projects that have approximately the right scope. You will pick something that interests you. Device specifications and design goals for each project will be worked out by each group in collaboration with Profs. Adams and McGruer as the project progresses - this will become the statement of work (due October 17, see below).

The scope of the project will include realistic structure and process designs for the microfabricated devices, modeling and simulation to demonstrate functionality, the drive/detection electronics, and a packaging concept.

Each project will have a team of approximately four students. Some teams may have similar topics..

1. Differential Pressure Flow Controller: Given a bulk-micromachined microvalve with stated flow-regulation and speed characteristics, design a piezoresistively sensed differential pressure sensor plus a feedback controller to implement a stable flow controller.

2. Force-feedback Accelerometer: In a wafer-bonded deep-RIE silicon process, design a capacitively-sensed in-plane force-balance accelerometer together with its readout circuit. Device geometry must be selected to achieve critical damping of the device response.

3. Resonant Strain Gauge: In a surface micromachining process, design a resonant strain gauge together with its drive circuit, and predict its sensitivity and temperature coefficient.

4. Micro Hot Plate: Design a micro hot plate, such as could be used as a platform for catalytic chemical sensors, to achieve specified temperature rise, uniformity, and response time.

Note that many projects of this sort are acceptable; each group will decide on a project in consultation with the instructors.

Project timeline:

1. Project white papers (less than one page) are due from each group October 3.

2. Full statement of work (approximately two pages) for the project due October 17.

3. Projects will be due the last week of class, or at the scheduled final exam period (more information later), and will include project presentations.

Final Report:

-The project final report should have an abstract with a short description of the key specifications of the device.

-It should also have a short introduction which should state the purpose of the device, have references to literature on similar devices, and a discussion of how the device in the project compares with other similar devices previously reported.

-The main part of the report should describe the design of the device, again giving references to the literature from which ideas were drawn. This will include the fabrication, the packaging, modeling and simulation, and various other aspects of the design. For example, if a certain oscillator circuit or measurement circuit was used, this should be cited with a reference to the source.

-At some point the overall characteristics of the device should be summarized in a form similar to a spec. sheet for the device, and some comments about the market for the device should be made. (One place for the market discussion is in the introduction.)

-Finally some conclusions should be drawn, both about the performance of the device as designed relative to existing solutions, and as to what work would be done in the future if the project were to continue.

-There is no minimum or maximum page length. However the report should be Clear, Concise, and Complete. There is no need to take more space than is necessary to give the reader a good understanding of your project. Do not aim your report to Professors Adams and McGruer who are already familiar with your work. Instead aim your report at a reader who, although familiar with MEMS, does not know anything about your project (other students in the class, for example).

-Submit two copies of your report in class no later than the time of your presentation