EECE 7244 and ME 6260,
Microelectromechanical Systems (MEMS)
Departments of Electrical and Computer Engineering and Mechanical and Industrial Engineering
Fall 2010, Monday & Thursday, 11:45-1:25 Room 260 West Village F
Professor George Adams
Office: 203 Snell Engineering
Phone: (617) 373-3826
FAX: (617) 373-2921
Hours: Mon. 10-11:30; Wed. 4-5; Thurs. 10:00-11:30, or by appointment, email or phone.
Professor Nick McGruer
Office: 326 Dana
Phone: (617) 373-2066
FAX: (617) 373-8970
Hours: Tuesday, 9:30-10:30, Friday, 9:30-10:30, or by appointment, e-mail or phone.
Second Exam on Thursday, Dec. 2, 8:00-9:40 am in 300 RI: You may bring 1 8.5x11 sheet of paper with notes (both sides).
Homework file name request from the TA grading homework: Could you please ask students to use the format lastname_firstname_hw# as their file name when they turn in their homework electronically? e.g., I'll name my homework as: Lai_Zhenhua_HW1.pdf.
Turn-in procedures Best is hand in after class or upload to Blackboard. You can also fax to the numbers above. On the faxes, please make sure that your name, professor's name(s), assignment, and course # are all on the front page. E-mail of one moderate-size file is ok as a last resort only if the other methods are not working - make sure to include the same information on the first page.
#1, Due Thursday, Sept. 16
Homework #2, Due Thursday, Sept. 23 Homework 2 Solutions 1 2 3
Homework #3, Due Thursday, Sept. 30, Homework #3 Notes, Homework #3 solutions 1 2 3 4 5 6 7 8
PSpice Intro, To obtain PSpice, you can download it from OrCAD at http://www.cadence.com/products/orcad/pages/downloads.aspx (OrCAD 16.3 Demo Software (Capture and PSpice only))
Teaming Survey, Due Monday, Sept. 20
Project Assignment (See dates in assignment.)
Homework #4, Due Thursday, Oct. 14, Homework #4 notes, Homework #4 Solutions 1 2 3 4 5 6 7 8 9 10 11 12 Notes on HW#4 solutions: Many choices of parameters are possible for problems 1, 2, and 3. Depending on your choice, the system may be underdamped, critically damped, or overdamped. In problems 2 and 3 I have shown examples of all three cases, but yours may be more extreme in the amount of overdamping or underdamping. In problem 5, the parameters are given, so you should have gotten a result similar to mine. One point of difference is in the pull-in voltage, which could either mean the "static" or the "dynamic" pull-in. The difference is that the static pull-in voltage is the one calculated in Senturia, while the dynamic pull-in voltage is a result of the momentum of the mass taking it past the static pull-in point when the switch is actuated by a sudden pulse, so the dynamic pull-in voltage is lower than the static pull-in voltage. I used the pull-in voltage found by changing the input voltage in the simulation, which if you think about it, is the dynamic pull-in voltage, so my result for the pull-in time at a voltage 1% greater than the pull-in voltage will indicate a much longer pull-in time than yours if you used the static pull-in voltage.
Homework #5, Due Monday, Oct. 25 Solutions
Practice Exam: 1 2 3 4 5
Exam Solutions 1 2 3 4
Homework #6, Due Monday, Nov. 1 Solutions
Homework #7, Due Monday, Nov. 8 Solutions
Filter Homework, Due Monday, Nov. 22 Solutions
Homework #8, Due Monday, Nov. 22 Solutions
Sample Exam 2
Project Presentation Schedule
Quick Guidelines for Technical Talks
Project Evaluation Form (For use in class or while viewing project presentations.)
Final report due12/13/10. Guidelines for the report are in the Project Assignment, above. Note that we do not want the report to be longer than it needs to be!! Try to be Clear, Concise, and Complete!
Introduction to MEMS Devices Class: Adams and McGruer. Nanotube Test. Kurt Petersen Si Time talk.
Microfabrication and Process Integration
Brief Notes on Transducers and Actuators
Lumped Element Modeling Introduction
Energy Conserving Transducers I
Energy Conserving Transducers II
Auxetic Material You Tube Video
Dynamics and Vibrations
Some filter background material: Intro, 1999 Paper, 2008 Paper, 2010 Paper
Electronics and Noise AD8021 AD825 ADXL193 ADXL204 CLC425
Course Outline (This may change somewhat!)
|No Class Monday. Introduction to MEMS and the Course, Transducers||Forward, Preface, Ch. 1, 2|
|MEMS Fabrication and Process Integration||Ch. 3, 4|
Lumped Modeling with Circuit Elements
|Energy Conserving Transducers||Ch. 6|
|Ch. 6, 7|
|Columbus Day, no Class Monday. MEMS Switch, MEMS Filter, Stress, Strain.||Ch. 8|
|Exam 1, MEMS Switch, Structural Mechanics.||Ch. 8, 9|
|MEMS Switch, Release, Adhesion, Thermal.||Ch. 11, 13|
|MEMS Filter, Dynamics and Vibrations||Ch. 9, 13|
|MEMS Filter,Veteran's Day, no Class Thursday.||Ch. 9, 13|
|MEMS Filter, Fluids.||Ch. 9, 13|
|Fundamentals of Noise, Thanksgiving, no Class Thursday.||Ch. 16|
|Noise in Electronics, Exam 2||Ch. 16|
|Finals Week: Project Presentations|
Additional Course Information:
Text: Microsystem Design, Stephen D. Senturia, Kluwer Academic Publishers, 2001, ISBN 0-7923-7246-8.
Prerequisites: Graduate Standing in Engineering.
Grading: Homework 25%, Exams 35% total, Projects 40%
OVERVIEW: This course will give a broad introduction to MEMS technology, and will give students an opportunity to study the current literature and to design MEMS. The course will cover a sufficient selection of the huge number of technologies used in MEMS such that the fabrication and operation of most MEMS devices will be understandable. This will also provide background for student design projects in the second half of the course. Design projects will run concurrently with discussion of MEMS physical principles and MEMS case studies in class. Topics include microfabrication and process integration; modeling of electromechanical components; transduction technologies; selected coverage of elasticity, structures, dissipation, contact mechanics, friction, and fluids, noise; and case studies of microsystems.
Note: Microfabrication of MEMS devices will be covered in order to understand the major MEMS fabrication technologies and how they interact with system design strategies. Some aspects of process integration will be discussed. For more complete coverage of microfabrication see ECE 3626, IC Fabrication.
Cooperation on coursework: There is no restriction on cooperation, discussions, use of texts, library materials, or other sources while learning how to do any assignment. If a solution to a problem is found in the literature, students are expected to provide correct citations to that literature. For the individual homework assignments, every student is expected, at the end, to have worked through their own analysis or modeling work, to have run their own computer models, and to have written up their own work for submission. Under no circumstances is it permitted to present another student's work as one’s own. For term projects, a single report from each team is to be prepared. Cooperation in this case is an essential part of the assignment.
References on reserve in the library:
1. Analysis and Design of Analog Integrated Circuits, Third Edition, Gray
and Meyer, Wiley, 1993, ISBN 0-471-57495-3. (This is a graduate-level electronics
2. The Science and Engineering of Microelectronic Fabrication, Second Edition, Campbell, Oxford, 2001, ISBN 0-19-513605-5. (General Microfabrication Reference.)
3. Fundamentals of Microfabrication, Madou, CRC Press, 1997, ISBN 0-8493-9451-1. (Microfabrication for MEMS + some information on materials and devices.)
4. Micromachined Transducers Sourcebook, Kovacs, McGraw-Hill, 1998, ISBN 0-07-290722-3. (General MEMS reference with an emphasis on a very large number of transduction methods.)
5. Microelectronic Circuits, Fourth Edition, Sedra and Smith, Oxford, 1998, ISBN 0-19-511663-1. (Undergraduate electronics text.)
6. Arthur P. Boresi, Richard J. Schmidt, Omar M. Sidebottom, Advanced Mechanics of Materials, 5th Edition John Wiley, 1993. (Introduction to elasticity and graduate level structural mechanics.)
7. Singiresu S. Rao, Mechanical Vibrations, 4th Edition, Pearson Prentice Hall, 2004. (Introduction to vibrations of mechanical systems.)
8. Dudley D. Fuller, Theory and Practice of Lubrication for Engineers, 2nd Edition, Wiley-Interscience, 1984. (Fundamentals of lubrication theory.)
9. F.P. Beer, E.R. Johnston, J.T. DeWolf, Mechanics of Materials, 3rd edition, McGraw-Hill, 2002. (Undergraduate structural mechanics)
Major conference proceedings:
Inspecting a microrelay.