Problems from Chapter 3:

1)  Problem 2.  Also, plot the total diffusivity (Eq. 3.7).

2)  Problem 7 (see Fig 2.4 for the solid solubility limit)

3)  Simulate the diffusion processes discussed in Example 3.2 (p.63) and Example 3.3 (p.64) using tsuprem4.
The input files are available from the ECE3626 Homepage.  These files have been translated from v.3 to v.4 for you.
 

a)  Compare the numerical solution found in Ex. 3.2 with the analytical expression developed in class assuming simple intrinsic diffusion.

b)  Determine the junction depth (i.e., where N_A = N_D) of the pn junction formed in Ex. 3.2 for both the analysis and simulation.
 
c)  For example 3.3, find the metallurgical base width (W).

d)  Suppose that a processing error occurred so that the wafer in example 3.3 was accidentally heated to 1100^oC for 5 minutes
in a nitrogen atmosphere.  Modify the tsuprem4 file to determine how this would affect the base width.